Custom oxygen-free-copper water-cooled heat sinks for high-power devices
Custom-designed and assembled water-cooled heat sinks using oxygen-free copper for high-power devices and equipment.
Problem solved
Provides a custom liquid-cooling component option where high heat loads cannot be managed by an air-cooled heat sink and the part must fit a defined device or equipment envelope.
Application contexts
- Supercomputers
- Semiconductor manufacturing equipment
- Thermoelectric power generation equipment
- Heavy electrical equipment
Technical principle
A machined oxygen-free-copper body incorporates coolant channels so circulating liquid removes heat from the device interface; the supplier states it can design and assemble custom water-cooled heat sinks.
Typical use cases
- Custom heat sinks for high-power electronic devices
- Liquid-cooled parts for semiconductor manufacturing equipment
- Cooling components for compute and power-conversion equipment
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: heat load and allowable device temperature · coolant type, inlet temperature, flow rate, and pressure · interface dimensions and mounting constraints · required material and surface treatment · leak-test and reliability requirements · annual quantity and prototype quantity
Have specific parameters to run against this asset?
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- Source: CLINE: precision metal machining and water-cooled heat sinks
- Original language: JA
- Summary AI-assisted; translation status: Unreviewed