Permanent via-plugging ink for package-substrate through-holes and laser BVH
One-component thermoset ink that fills plated through-holes and laser blind vias on MPU package and HDI boards so the surface can be cap-plated and treated as via-free.
Problem solved
Open plated vias block fine build-up and create reliability voids; a printable, grindable fill that accepts cap plating lets the board return to a flat, via-free surface.
Application contexts
- MPU package substrates
- High-frequency module boards
- HDI and mobile boards requiring via-in-pad
Technical principle
Company lists one-component heat-cure PHP900 grades. IR-10F and IR-15S-3 are described as high Tg / low CTE with improved print fill, grindability and (IR-10F) cap-plating strength; IR-6P/6PH emphasizes print fill, grindability, productivity and cost. Named uses: CSP, FCPKG, PBGA, HDI.
Typical use cases
- Permanent fill of PTH before cap plating on package substrates
- Laser BVH plug on HDI / FCPKG
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: via type (PTH vs laser BVH) and diameter · required Tg / CTE · cap-plating stack · whether the stack is organic or glass-core
Have specific parameters to run against this asset?
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- Source: 永久穴詰めインク｜電子材料部門｜山栄化学株式会社
- Original language: JA
- Summary AI-assisted; translation status: Unreviewed