Permanent via-plugging ink for package-substrate through-holes and laser BVH
One-component thermoset ink that fills plated through-holes and laser blind vias on MPU package and HDI boards so the surface can be cap-plated and treated as via-free.
AI-assisted directory summary. Technical specifications, performance metrics, readiness and compliance labels are unverified unless individually supported and reviewed. Proposed partnership routes do not establish supplier consent, export eligibility, or willingness to sign an NDA. Confirm claims and test conditions with the linked sources and supplier before procurement or citation.
Problem solved
Open plated vias block fine build-up and create reliability voids; a printable, grindable fill that accepts cap plating lets the board return to a flat, via-free surface.
Application contexts
- MPU package substrates
- High-frequency module boards
- HDI and mobile boards requiring via-in-pad
Technical principle
Company lists one-component heat-cure PHP900 grades. IR-10F and IR-15S-3 are described as high Tg / low CTE with improved print fill, grindability and (IR-10F) cap-plating strength; IR-6P/6PH emphasizes print fill, grindability, productivity and cost. Named uses: CSP, FCPKG, PBGA, HDI.
Typical use cases
- Permanent fill of PTH before cap plating on package substrates
- Laser BVH plug on HDI / FCPKG
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: via type (PTH vs laser BVH) and diameter · required Tg / CTE · cap-plating stack · whether the stack is organic or glass-core
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Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Original language: JA.
Record updated: .
- 永久穴詰めインク｜電子材料部門
https://www.san-eikagaku.com/electron/product/permanent_hole_plugging_ink.html
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- ISO｜会社情報
https://www.san-eikagaku.com/company/iso/
Supporting / discovery source; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.