Powder-metallurgy interconnect plates for SOFC/SOEC
Custom-manufactured metal interconnect plates and porous metal substrates using powder metallurgy for high-temperature SOFC and SOEC stacks.
AI-assisted directory summary. Technical specifications, performance metrics, readiness and compliance labels are unverified unless individually supported and reviewed. Proposed partnership routes do not establish supplier consent, export eligibility, or willingness to sign an NDA. Confirm claims and test conditions with the linked sources and supplier before procurement or citation.
Problem solved
Conventional interconnects suffer from oxidation, Cr evaporation, and poor thermal cycling performance in high-temperature electrolysis/fuel cell environments, raising reliability and cost barriers for SOEC deployment.
Application contexts
- SOEC/SOFC stack manufacturing
- hydrogen production systems
- e-methane synthesis equipment
Technical principle
Powder metallurgy forming and sintering of specialty alloy interconnect plates with optional plasma-spray coatings or porous structures; enables precise control of porosity, strength, and surface properties for stack integration.
Typical use cases
- component supply for SOEC stack developers targeting industrial or maritime hydrogen applications
- custom porous substrates for advanced cell designs
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: alloy grade or porosity requirements · coating specifications · stack size and operating conditions · volume and qualification timeline
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Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Original language: JAPANESE.
Record updated: .
- 固体酸化物燃料電池および電解セル
https://tw.porite.com/jp/applicationsc3-%E5%9B%BA%E4%BD%93%E9%85%B8%E5%8C%96%E7%87%83%E6%96%99%E9%9B%BB%E6%B1%A0%E3%81%8A%E3%82%88%E3%81%B3%E9%9B%BB%E8%A7%A3%E3%82%BB%E3%83%AB
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- SOFC用の多孔質金属基板の開発により、高強度・高性能多孔質金属基板の開発
https://www.chusho.meti.go.jp/sapoin/index.php/cooperation/project/detail/4805
Supporting / discovery source; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.