Powder-metallurgy interconnect plates for SOFC/SOEC
Custom-manufactured metal interconnect plates and porous metal substrates using powder metallurgy for high-temperature SOFC and SOEC stacks.
Problem solved
Conventional interconnects suffer from oxidation, Cr evaporation, and poor thermal cycling performance in high-temperature electrolysis/fuel cell environments, raising reliability and cost barriers for SOEC deployment.
Application contexts
- SOEC/SOFC stack manufacturing
- hydrogen production systems
- e-methane synthesis equipment
Technical principle
Powder metallurgy forming and sintering of specialty alloy interconnect plates with optional plasma-spray coatings or porous structures; enables precise control of porosity, strength, and surface properties for stack integration.
Typical use cases
- component supply for SOEC stack developers targeting industrial or maritime hydrogen applications
- custom porous substrates for advanced cell designs
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: alloy grade or porosity requirements · coating specifications · stack size and operating conditions · volume and qualification timeline
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- Source: 固体酸化物燃料電池および電解セル / SOFC用の多孔質金属基板の開発
- Original language: JAPANESE
- Summary AI-assisted; translation status: Unreviewed