Femto-pro Femtosecond Laser Machine for TGV Drilling in Glass Core Substrates
A compact femtosecond laser processing machine with proprietary GHz Pulse Injection Technology that forms TGV holes in glass directly via laser ablation without special optics or post-etching, achieving aspect ratios up to 240:1 in thin glass.
Problem solved
The complexity and cost of conventional TGV formation that requires laser modification + wet etching (multi-step, wet chemistry, environmental waste). Simpler direct laser drilling could reduce the process chain and eliminate chemical handling.
Application contexts
- TGV drilling for glass core substrates in advanced semiconductor packaging
- Glass interposer via formation for chiplet integration
- Transparent material micro-machining for optical and sensor applications
- Research and development of alternative TGV processes
Technical principle
GHz Pulse Injection Technology delivers high-repetition-rate femtosecond laser pulse trains into the glass volume. The high-density energy deposition creates a localized modification zone along the beam path. By controlling pulse parameters and stage positioning, a through-hole is formed entirely by the laser without requiring subsequent wet etching. No Bessel beam or other special beam-shaping optics are needed — standard Gaussian beam optics suffice.
Typical use cases
- Direct laser TGV formation for glass-core substrate R&D
- High-aspect-ratio micro-hole drilling in glass for interposer prototypes
- Alternative process evaluation for companies seeking to simplify TGV workflow
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: Throughput (vias/second) at production-relevant panel sizes · Positional accuracy across 510×515mm panel · Demonstrated results on semiconductor-grade alkali-free glass (EAGLE XG, EN-A1) · Equipment cost and estimated TCO vs. LPKF LIDE or DISCO alternatives · Cu plating compatibility: wall roughness after laser-only drilling
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- Source: 次世代半導体パッケージ向けガラスコア基板加工に適用可能、特殊光学系を用いない深穴加工を実証
- Original language: JA
- Summary AI-assisted; translation status: Unreviewed