Femto-pro Femtosecond Laser Machine for TGV Drilling in Glass Core Substrates
A compact femtosecond laser processing machine with proprietary GHz Pulse Injection Technology that forms TGV holes in glass directly via laser ablation without special optics or post-etching, achieving aspect ratios up to 240:1 in thin glass.
AI-assisted directory summary. Technical specifications, performance metrics, readiness and compliance labels are unverified unless individually supported and reviewed. Proposed partnership routes do not establish supplier consent, export eligibility, or willingness to sign an NDA. Confirm claims and test conditions with the linked sources and supplier before procurement or citation.
Problem solved
The complexity and cost of conventional TGV formation that requires laser modification + wet etching (multi-step, wet chemistry, environmental waste). Simpler direct laser drilling could reduce the process chain and eliminate chemical handling.
Application contexts
- TGV drilling for glass core substrates in advanced semiconductor packaging
- Glass interposer via formation for chiplet integration
- Transparent material micro-machining for optical and sensor applications
- Research and development of alternative TGV processes
Technical principle
GHz Pulse Injection Technology delivers high-repetition-rate femtosecond laser pulse trains into the glass volume. The high-density energy deposition creates a localized modification zone along the beam path. By controlling pulse parameters and stage positioning, a through-hole is formed entirely by the laser without requiring subsequent wet etching. No Bessel beam or other special beam-shaping optics are needed — standard Gaussian beam optics suffice.
Typical use cases
- Direct laser TGV formation for glass-core substrate R&D
- High-aspect-ratio micro-hole drilling in glass for interposer prototypes
- Alternative process evaluation for companies seeking to simplify TGV workflow
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: Throughput (vias/second) at production-relevant panel sizes · Positional accuracy across 510×515mm panel · Demonstrated results on semiconductor-grade alkali-free glass (EAGLE XG, EN-A1) · Equipment cost and estimated TCO vs. LPKF LIDE or DISCO alternatives · Cu plating compatibility: wall roughness after laser-only drilling
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Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Original language: JA.
Record updated: .
- 次世代半導体パッケージ向けガラスコア基板加工に適用可能、特殊光学系を用いない深穴加工を実証
https://www.symphotony.com/press-release/femto-pro-2/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- 株式会社光響 企業情報
https://www.ki21.jp/bp/company-search/detail?company_id=1962
Supporting / discovery source; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.