Chemical Etch TGV Processing for Large-Format Glass Core Substrates
Chemical etching of high-aspect-ratio through-glass vias (TGV) on panels up to 510x515mm with diameters from 20µm, multiple shapes, and integrated Cu plating for semiconductor interposers.
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Problem solved
Scalable formation of dense vertical interconnects in large glass panels for cost-effective glass-core substrates used in co-packaged optics and high-density AI packaging.
Application contexts
- glass core substrates
- glass interposers
- semiconductor packaging
Technical principle
Chemical etching to create vertical, hourglass or tapered vias in various glasses, followed by conformal or filling copper plating with high adhesion.
Typical use cases
- Large panel TGV for CPO substrates
- high-aspect via interposers
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: panel size · via diameter/aspect ratio/shape · glass type · plating type · position accuracy
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Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Original language: JAPANESE.
Record updated: .
- 微細貫通穴（TGV）
https://nsc-net.co.jp/anaake/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
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