PrototypeCapability Asset

Chemical Etch TGV Processing for Large-Format Glass Core Substrates

Chemical etching of high-aspect-ratio through-glass vias (TGV) on panels up to 510x515mm with diameters from 20µm, multiple shapes, and integrated Cu plating for semiconductor interposers.

Problem solved

Scalable formation of dense vertical interconnects in large glass panels for cost-effective glass-core substrates used in co-packaged optics and high-density AI packaging.

Application contexts

glass core substrates
glass interposers
semiconductor packaging

Technical principle

Chemical etching to create vertical, hourglass or tapered vias in various glasses, followed by conformal or filling copper plating with high adhesion.

Typical use cases

Large panel TGV for CPO substrates
high-aspect via interposers

Partnership route

How global engineering teams typically engage this asset.

01Technical Interview

02Nda

03Feasibility Review

04Prototype

Helpful to include: panel size · via diameter/aspect ratio/shape · glass type · plating type · position accuracy

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Provider

Not yet linked.

Source & provenance

Source: 微細貫通穴（TGV）
Original language: JAPANESE
Summary AI-assisted; translation status: Unreviewed