NSC Co., Ltd.
Osaka, Japan Export Ready Japanese, English, Chinese
Chemical etching specialist offering large-format through-glass via (TGV) fabrication on glass substrates up to 730x920mm for 2.5D/3D semiconductor packaging.
Core capabilities
- chemical-etching
- high-aspect-ratio-tgv
- large-panel-processing
- copper-plating-for-tgv
- glass-surface-precision
Related capability assets
Chemical Etch TGV Processing for Large-Format Glass Core Substrates
Chemical etching of high-aspect-ratio through-glass vias (TGV) on panels up to 510x515mm with diameters from 20µm, multiple shapes, and integrated Cu plating for semiconductor interposers.
Large-Format Through-Glass Via Fabrication via Chemical Etching
Chemical etching process for high-aspect-ratio TGVs on large glass panels (up to 730x920mm) with fine vias (φ20μm–φ200μm) and integrated copper plating for 2.5D/3D interposers.