NSC Co., Ltd.

Osaka, Japan Export Ready Japanese, English, Chinese

Chemical etching specialist offering large-format through-glass via (TGV) fabrication on glass substrates up to 730x920mm for 2.5D/3D semiconductor packaging.

Core capabilities

chemical-etching
high-aspect-ratio-tgv
large-panel-processing
copper-plating-for-tgv
glass-surface-precision

Related capability assets

Large-Format Through-Glass Via Fabrication via Chemical Etching

Chemical etching process for high-aspect-ratio TGVs on large glass panels (up to 730x920mm) with fine vias (φ20μm–φ200μm) and integrated copper plating for 2.5D/3D interposers.