NSC Co., Ltd.
Chemical etching specialist offering large-format through-glass via (TGV) fabrication on glass substrates up to 730x920mm for 2.5D/3D semiconductor packaging.
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Core capabilities
- chemical-etching
- high-aspect-ratio-tgv
- large-panel-processing
- copper-plating-for-tgv
- glass-surface-precision
Related capability assets
Chemical etching process for high-aspect-ratio TGVs on large glass panels (up to 730x920mm) with fine vias (φ20μm–φ200μm) and integrated copper plating for 2.5D/3D interposers.
Chemical etching of high-aspect-ratio through-glass vias (TGV) on panels up to 510x515mm with diameters from 20µm, multiple shapes, and integrated Cu plating for semiconductor interposers.
Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Record updated: .
- TGV fabrication process – NSC Co., Ltd.
https://nsc-net.co.jp/en/anaake/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- NSC Co., Ltd. | Fine surface precision technology of glass and metal by chemical
https://nsc-net.co.jp/en/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
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