Large-Format Through-Glass Via Fabrication via Chemical Etching
Chemical etching process for high-aspect-ratio TGVs on large glass panels (up to 730x920mm) with fine vias (φ20μm–φ200μm) and integrated copper plating for 2.5D/3D interposers.
Problem solved
Wafer-scale TGV limits panel-level manufacturing economics and throughput for high-volume advanced packaging in AI servers or high-density interconnects; organic cores lack the flatness and low-loss benefits of glass.
Application contexts
- 2.5d-interposers
- 3d-semiconductor-packages
- lcd-display-components
- high-density-interconnect-substrates
Technical principle
Proprietary chemical etching creates high-aspect-ratio through-holes in large thin glass substrates, followed by copper plating for conductive vias suitable for interposer and semiconductor package applications.
Typical use cases
- Panel-level glass interposers for cost-effective 2.5D/3D packaging in AI accelerators
- Large-format TGV substrates for high-density RF or sensor modules
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: panel size and thickness requirements · via diameter, pitch, aspect ratio targets · copper fill or metallization specs · target application (interposer vs display vs packaging) · volume expectations
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- Source: TGV fabrication process – NSC Co., Ltd.
- Original language: ENGLISH
- Summary AI-assisted; translation status: Unreviewed