Large-Format Through-Glass Via Fabrication via Chemical Etching
Chemical etching process for high-aspect-ratio TGVs on large glass panels (up to 730x920mm) with fine vias (φ20μm–φ200μm) and integrated copper plating for 2.5D/3D interposers.
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Problem solved
Wafer-scale TGV limits panel-level manufacturing economics and throughput for high-volume advanced packaging in AI servers or high-density interconnects; organic cores lack the flatness and low-loss benefits of glass.
Application contexts
- 2.5d-interposers
- 3d-semiconductor-packages
- lcd-display-components
- high-density-interconnect-substrates
Technical principle
Proprietary chemical etching creates high-aspect-ratio through-holes in large thin glass substrates, followed by copper plating for conductive vias suitable for interposer and semiconductor package applications.
Typical use cases
- Panel-level glass interposers for cost-effective 2.5D/3D packaging in AI accelerators
- Large-format TGV substrates for high-density RF or sensor modules
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: panel size and thickness requirements · via diameter, pitch, aspect ratio targets · copper fill or metallization specs · target application (interposer vs display vs packaging) · volume expectations
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Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Original language: ENGLISH.
Record updated: .
- TGV fabrication process – NSC Co., Ltd.
https://nsc-net.co.jp/en/anaake/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.