PilotCapability Asset

Copper Paste for Electrode and Wiring Formation

Mass-producible copper paste enabling low-resistance electrodes and wiring as direct substitute for silver paste in photovoltaic and electronic devices.

Problem solved

High material cost and supply constraints of silver paste in electrode formation for solar cells and battery-related electronics.

Application contexts

perovskite-solar
silicon-solar
ev-power-electronics
sensor-electrodes

Technical principle

Formulated copper-based conductive paste that achieves equivalent or superior conductivity and conversion efficiency through optimized particle dispersion and sintering.

Typical use cases

solar cell front-side metallization
EV component interconnects
sensor electrode patterning

Partnership route

How global engineering teams typically engage this asset.

01Technical Interview

02Nda

03Feasibility Review

04Prototype

05Joint Development

Helpful to include: target substrate · required conductivity · process temperature limit · volume requirements

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Provider

Material Concept, Inc.

Source & provenance

Source: Material Concept, Inc. Product Description
Original language: EN
Summary AI-assisted; translation status: Unreviewed