Copper Paste for Electrode and Wiring Formation
Mass-producible copper paste enabling low-resistance electrodes and wiring as direct substitute for silver paste in photovoltaic and electronic devices.
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Problem solved
High material cost and supply constraints of silver paste in electrode formation for solar cells and battery-related electronics.
Application contexts
- perovskite-solar
- silicon-solar
- ev-power-electronics
- sensor-electrodes
Technical principle
Formulated copper-based conductive paste that achieves equivalent or superior conductivity and conversion efficiency through optimized particle dispersion and sintering.
Typical use cases
- solar cell front-side metallization
- EV component interconnects
- sensor electrode patterning
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: target substrate · required conductivity · process temperature limit · volume requirements
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Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Original language: EN.
Record updated: .
- Material Concept, Inc. Official Site
http://www.mat-concept.com/english/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.