Material Concept, Inc.
Developer of copper paste technology as alternative to silver paste for electrodes and wiring in solar cells, semiconductors, sensors, and EV components.
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Core capabilities
- conductive-paste-formulation
- low-resistance-electrode-formation
- cost-reduction-material-substitution
Related capability assets
Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Record updated: .
- Material Concept, Inc. Official Site - Copper Paste
http://www.mat-concept.com/english/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- Product Page - Cu Paste
http://www.mat-concept.com/english/product/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.