One-Stop TGV Glass Core Substrate Processing Service
End-to-end contract manufacturing service for TGV (Through Glass Via) glass core substrates, covering glass procurement, laser drilling, metallization, copper plating, polishing, dicing, and inspection in a single workflow using LPKF LIDE technology.
Problem solved
The complexity and yield risk of managing separate vendors for TGV drilling, seed layer deposition, copper plating, and finishing in glass core substrate production for AI advanced packaging.
Application contexts
- AI server FC-BGA glass core substrates
- 2.5D/3D glass interposers for high-performance computing
- RF/microwave modules requiring low-loss glass substrates
- Photonics packaging with glass as optical/electrical substrate
Technical principle
LPKF LIDE (Laser Induced Deep Etching) creates crack-free micro-vias in glass by laser modification followed by wet etching, achieving sidewall roughness Ra≤0.08μm. The via sidewall is then metallized via sputtering or electroless copper plating (seed layer), followed by electroplated copper for conformal coating or complete hole filling. Surface circuit patterning and final finishing complete the substrate.
Typical use cases
- Prototype-to-pilot TGV glass core substrate manufacturing for advanced packaging qualification
- Cu-plated TGV via arrays for high-density interconnects in FC-BGA substrates
- Glass interposer fabrication for chiplet integration in AI accelerators
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: Current maximum TGV via count per panel at pilot scale · Cu plating quality data (void rate, filling ratio) for 50-200μm diameter vias · Positional accuracy statistics across 510×515mm panel · Non-disclosure agreement for detailed process specifications
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- Source: TGVメーカーの選び方！半導体・ガラスコア基板の微細加工を解説
- Original language: JA
- Summary AI-assisted; translation status: Unreviewed