EBINAX株式会社 (EBINAX Co., Ltd.)

東京都大田区東糀谷5-22-13, Japan Limited Japanese

End-to-end processing service provider for TGV (Through Glass Via) glass core substrates, covering glass procurement, micro-hole drilling via LPKF LIDE laser technology, seed layer formation, copper plating (conformal and filling), polishing, dicing, and inspection in a single workflow.

Core capabilities

End-to-end TGV glass core substrate processing (laser drilling + metallization + plating + finishing)
LPKF LIDE laser-induced deep etching for crack-free micro-vias
Copper plating for TGV sidewall conformal and hole-filling
Multi-glass-type processing (EagleXG, TEMPAX, synthetic quartz, borosilicate)

Related capability assets

One-Stop TGV Glass Core Substrate Processing Service

End-to-end contract manufacturing service for TGV (Through Glass Via) glass core substrates, covering glass procurement, laser drilling, metallization, copper plating, polishing, dicing, and inspection in a single workflow using LPKF LIDE technology.