EBINAX株式会社 (EBINAX Co., Ltd.)
End-to-end processing service provider for TGV (Through Glass Via) glass core substrates, covering glass procurement, micro-hole drilling via LPKF LIDE laser technology, seed layer formation, copper plating (conformal and filling), polishing, dicing, and inspection in a single workflow.
AI-assisted directory profile. Export readiness, certifications, technical claims and partnership preferences are unverified unless individually supported and reviewed. Listing does not establish supplier endorsement or willingness to enter an NDA. Confirm with the original sources and supplier before procurement or citation.
Core capabilities
- End-to-end TGV glass core substrate processing (laser drilling + metallization + plating + finishing)
- LPKF LIDE laser-induced deep etching for crack-free micro-vias
- Copper plating for TGV sidewall conformal and hole-filling
- Multi-glass-type processing (EagleXG, TEMPAX, synthetic quartz, borosilicate)
Related capability assets
Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Record updated: .
- TGVメーカーの選び方！半導体・ガラスコア基板の微細加工を解説
https://ebinadk.com/tgv-manufacturer
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- EBINAX株式会社 トップページ
https://ebinadk.com/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- EBINAX株式会社 - iPROS企業情報
https://mono.ipros.com/company/detail/329087/
Supporting / discovery source; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.