Chemical Etching TGV and Cavity Processing for Glass Substrates
Chemical etching-based micro-processing service for TGV through-holes and cavity recesses in glass, using in-house custom-blended etchants to handle diverse glass compositions for semiconductor packaging and advanced substrate applications.
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Problem solved
The difficulty of producing crack-free TGV vias and precision cavities in varied glass compositions, especially for non-standard glasses where conventional laser-only or standard etching processes produce suboptimal results.
Application contexts
- Embedded glass cavity substrates for component integration
- Glass interposer prototyping for semiconductor packaging
- Microfluidic device glass substrates
- OLED sealing/encapsulation glass processing
Technical principle
Ultra-short-pulse laser creates modified regions along the intended via/cavity path. The modified glass is then preferentially etched away using custom-blended HF-based etchant formulations. In-house etchant development allows optimization for each glass composition's etch rate, anisotropy, and surface quality requirements. The chemical approach avoids the mechanical stress and microcracking of dry machining.
Typical use cases
- TGV micro-via development on non-standard glass compositions for R&D
- Small-batch glass cavity substrates for embedded passive/active device integration
- Rapid prototype glass interposer samples for proof-of-concept
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: Minimum TGV via diameter and positional accuracy achievable · Glass composition compatibility list with process recipes · Maximum substrate size and thickness range · Cavity depth control accuracy and minimum feature size
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Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Original language: JA.
Record updated: .
- 会社案内 - 武蔵野ファインガラス
https://www.mfg.jp/company/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- ガラス受託加工TOP
https://www.mfg.jp/service/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.