武蔵野ファインガラス株式会社 (Musashino Fine Glass Co., Ltd.)

埼玉県川越市下赤坂617-3, Japan None Japanese

Ultra-small glass etching specialist (16 employees) offering TGV micro-hole processing, cavity forming, slimming, and chemical cutting for semiconductor glass packaging and advanced substrates, using laser modification + wet etching with in-house blended etchants.

Core capabilities

TGV micro-hole processing by laser modification + HF wet etching
Glass cavity forming (recess/well) for embedded component packaging
Glass slimming (thinning) to ultra-thin dimensions
Chemical cutting and chamfering of glass panels
In-house custom etchant blending for diverse glass compositions

Related capability assets

Chemical Etching TGV and Cavity Processing for Glass Substrates

Chemical etching-based micro-processing service for TGV through-holes and cavity recesses in glass, using in-house custom-blended etchants to handle diverse glass compositions for semiconductor packaging and advanced substrate applications.