武蔵野ファインガラス株式会社 (Musashino Fine Glass Co., Ltd.)
Ultra-small glass etching specialist (16 employees) offering TGV micro-hole processing, cavity forming, slimming, and chemical cutting for semiconductor glass packaging and advanced substrates, using laser modification + wet etching with in-house blended etchants.
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Core capabilities
- TGV micro-hole processing by laser modification + HF wet etching
- Glass cavity forming (recess/well) for embedded component packaging
- Glass slimming (thinning) to ultra-thin dimensions
- Chemical cutting and chamfering of glass panels
- In-house custom etchant blending for diverse glass compositions
Related capability assets
Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Record updated: .
- 会社案内 - 武蔵野ファインガラス
https://www.mfg.jp/company/
Primary-source candidate; evidence review: pending.
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Source publication date: Not recorded.
- ガラス受託加工TOP
https://www.mfg.jp/service/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
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