Precision TGV Fabrication for Glass-Core Substrates and Co-Packaged Optics
Custom Through-Glass Via (TGV) microfabrication on glass substrates up to 510mm panels with 20µm min diameter, void-free Cu fill, and post-processing for photonic and semiconductor interposers.
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Problem solved
High-density, low-loss vertical interconnects in glass interposers for integrating optics close to ASICs in CPO, addressing bandwidth, power, and thermal density in AI servers.
Application contexts
- co-packaged optics
- glass core substrates
- 2.5D/3D packaging for AI accelerators
Technical principle
Laser or chemical formation of high-aspect-ratio vias in glass (borosilicate, fused silica, etc.), followed by Ti/Cu seed and electroplated Cu fill or conformal coating, with CMP planarization and RDL.
Typical use cases
- CPO optical engine integration
- glass interposer for high-bandwidth AI chips
Partnership route
How global engineering teams typically engage this asset.
Helpful to include: via diameter/pitch · glass type/thickness · fill type (void-free/conformal) · panel size · RDL requirements
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Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Original language: ENGLISH.
Record updated: .
- TGV Fabrication - Through-Glass Vias
https://www.nanosystemsjp.co.jp/tgv-fabrication.html
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.