Nanosystems JP Inc.

Tokyo, Japan Nda Ready · unverified Japanese, English

Precision microfabrication foundry specializing in Through-Glass Via (TGV) and advanced packaging processes for photonics and semiconductor interposers.

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Core capabilities

TGV fabrication
glass interposer processing
Cu filling and CMP
thin-film deposition
RDL fabrication

Related capability assets

Precision TGV Fabrication for Glass-Core Substrates and Co-Packaged Optics

Custom Through-Glass Via (TGV) microfabrication on glass substrates up to 510mm panels with 20µm min diameter, void-free Cu fill, and post-processing for photonic and semiconductor interposers.

Source & provenance

Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.

Record updated: 2026-07-09.

TGV Fabrication - Through-Glass Vias
https://www.nanosystemsjp.co.jp/tgv-fabrication.html
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): 2026-07-09.
Source publication date: Not recorded.

Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.