Nanosystems JP Inc.

Tokyo, Japan Nda Ready Japanese, English

Precision microfabrication foundry specializing in Through-Glass Via (TGV) and advanced packaging processes for photonics and semiconductor interposers.

Core capabilities

TGV fabrication
glass interposer processing
Cu filling and CMP
thin-film deposition
RDL fabrication

Related capability assets

Precision TGV Fabrication for Glass-Core Substrates and Co-Packaged Optics

Custom Through-Glass Via (TGV) microfabrication on glass substrates up to 510mm panels with 20µm min diameter, void-free Cu fill, and post-processing for photonic and semiconductor interposers.