Kitagawa Gress Tech Co., Ltd.

Hanamigawa-ku, Chiba, Japan Unknown Japanese Official site

CMP, grind and dicing contract shop (Kitagawa group) that lists TSV and TGV metal-fill planarization among its semiconductor process services.

Core capabilities

Contract CMP process development and lot processing
TSV / TGV filled-metal planarization
Damascene and interlayer dielectric planarization
Post-CMP clean, grind and metrology on wafers up to 300 mm

Related capability assets

Contract CMP planarization of TSV and TGV filled-metal surfaces

Chemical-mechanical polish of copper-filled through-silicon or through-glass vias so the metal and substrate finish as a single plane for subsequent interconnect.