Kitagawa Gress Tech Co., Ltd.

Hanamigawa-ku, Chiba, Japan Unknown · unverified Japanese Official site

CMP, grind and dicing contract shop (Kitagawa group) that lists TSV and TGV metal-fill planarization among its semiconductor process services.

AI-assisted directory profile. Export readiness, certifications, technical claims and partnership preferences are unverified unless individually supported and reviewed. Listing does not establish supplier endorsement or willingness to enter an NDA. Confirm with the original sources and supplier before procurement or citation.

Core capabilities

Contract CMP process development and lot processing
TSV / TGV filled-metal planarization
Damascene and interlayer dielectric planarization
Post-CMP clean, grind and metrology on wafers up to 300 mm

Related capability assets

Contract CMP planarization of TSV and TGV filled-metal surfaces

Chemical-mechanical polish of copper-filled through-silicon or through-glass vias so the metal and substrate finish as a single plane for subsequent interconnect.

Source & provenance

Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.

Record updated: 2026-08-19.

半導体CMP受託加工サービス
https://www.kitagawagt.co.jp/business/semiconductor-contract-processing/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): 2026-08-19.
Source publication date: Not recorded.
会社概要 | 北川グレステック株式会社
https://www.kitagawagt.co.jp/company/outline/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): 2026-08-19.
Source publication date: Not recorded.

Collector timestamps record when a source was stored, not an independent verification date. Source links provide context; they do not validate every specification, readiness label, certification, or proposed partnership route.