株式会社ニチワ工業 (Nichiwa Kogyo Co., Ltd.)

長野県茅野市本町東3-17, Japan Limited Japanese

Semiconductor back-end processing specialist that developed LET (Laser & Etching Technology) for TGV formation on glass substrates using picosecond lasers, achieving aspect ratios up to 9:1 with ±10μm positional accuracy, targeting 2.5D/3D chiplet packaging and glass interposer applications.

Core capabilities

LET (Laser & Etching Technology) for TGV formation on glass substrates
Picosecond laser drilling + wet etching for crack-free glass micro-vias
Glass dicing, backgrinding, surface grinding/polishing
SiC wafer processing for EV power devices
Multi-shape TGV capability (straight, hourglass, tapered; round, polygonal, custom shapes)

Related capability assets

LET (Laser & Etching Technology) for TGV Glass Substrate Processing

Proprietary picosecond laser + wet etching process for forming TGV through-holes in glass substrates, achieving aspect ratios up to 9:1, positional accuracy ±10μm, and supporting straight, hourglass, and tapered via profiles for 2.5D/3D packaging and glass interposer applications.