株式会社ニチワ工業 (Nichiwa Kogyo Co., Ltd.)
Semiconductor back-end processing specialist that developed LET (Laser & Etching Technology) for TGV formation on glass substrates using picosecond lasers, achieving aspect ratios up to 9:1 with ±10μm positional accuracy, targeting 2.5D/3D chiplet packaging and glass interposer applications.
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Core capabilities
- LET (Laser & Etching Technology) for TGV formation on glass substrates
- Picosecond laser drilling + wet etching for crack-free glass micro-vias
- Glass dicing, backgrinding, surface grinding/polishing
- SiC wafer processing for EV power devices
- Multi-shape TGV capability (straight, hourglass, tapered; round, polygonal, custom shapes)
Related capability assets
Source & provenance
Translation review status: unreviewed. Publication does not establish technical verification or supplier endorsement.
Record updated: .
- ガラスへの微細貫通孔加工(TGV)や真円微細加工技術
https://www.nichiwak.co.jp/business/lasertechnology/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
- 会社概要
https://www.nichiwak.co.jp/company/outline/
Primary-source candidate; evidence review: pending.
Source accessed / recorded (collector timestamp): .
Source publication date: Not recorded.
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