TECNISCO, LTD.

Tokyo, Japan Export Ready Japanese, English

Microfabrication specialist providing through-glass via (TGV) processing for glass wafers used in 3D wafer-level packaging and RF/MEMS applications.

Core capabilities

through-glass-via formation
glass micro-machining
anodic bonding
metallization
hermetic sealing

Related capability assets

Through-Glass Via Wafer Processing for 3D WLP and RF Applications

Precision TGV formation on borosilicate/alkali-free glass wafers (≤φ200mm) enabling hermetic vertical interconnects with low stray capacitance and high-frequency performance.