Advanced packaging / glass processing
Through-glass via (TGV) glass substrate capabilities
This hub brings together published Japanese capabilities for making and finishing through-glass vias (TGVs). The records cover both individual process steps and one-stop glass-core substrate workflows, so overseas engineering teams can start with the constraint they need to solve.
7 published capability assets in this hub.
What this covers
- TGV formation on glass wafers and large-format glass panels
- Laser drilling, chemical etching, metallization, copper plating, polishing, dicing, and inspection
- Glass-core substrates, 2.5D/3D packaging, RF/MEMS, and co-packaged optics workflows
Published capability assets
Compare the problem solved, constraints, readiness, and partnership route on each record.
Through-Glass Via Wafer Processing for 3D WLP and RF Applications
Precision TGV formation on borosilicate/alkali-free glass wafers (≤φ200mm) enabling hermetic vertical interconnects with low stray capacitance and high-frequency performance.
Conventional TSV or organic substrates suffer from higher parasitic capacitance, thermal mismatch, or outgassing in miniaturized RF/MEMS and 3D packaged devices for AI edge or sensor modules.
Large-Format Through-Glass Via Fabrication via Chemical Etching
Chemical etching process for high-aspect-ratio TGVs on large glass panels (up to 730x920mm) with fine vias (φ20μm–φ200μm) and integrated copper plating for 2.5D/3D interposers.
Wafer-scale TGV limits panel-level manufacturing economics and throughput for high-volume advanced packaging in AI servers or high-density interconnects; organic cores lack the flatness and low-loss benefits of glass.
Precision TGV Fabrication for Glass-Core Substrates and Co-Packaged Optics
Custom Through-Glass Via (TGV) microfabrication on glass substrates up to 510mm panels with 20µm min diameter, void-free Cu fill, and post-processing for photonic and semiconductor interposers.
High-density, low-loss vertical interconnects in glass interposers for integrating optics close to ASICs in CPO, addressing bandwidth, power, and thermal density in AI servers.
Chemical Etch TGV Processing for Large-Format Glass Core Substrates
Chemical etching of high-aspect-ratio through-glass vias (TGV) on panels up to 510x515mm with diameters from 20µm, multiple shapes, and integrated Cu plating for semiconductor interposers.
Scalable formation of dense vertical interconnects in large glass panels for cost-effective glass-core substrates used in co-packaged optics and high-density AI packaging.
One-Stop TGV Glass Core Substrate Processing Service
End-to-end contract manufacturing service for TGV (Through Glass Via) glass core substrates, covering glass procurement, laser drilling, metallization, copper plating, polishing, dicing, and inspection in a single workflow using LPKF LIDE technology.
The complexity and yield risk of managing separate vendors for TGV drilling, seed layer deposition, copper plating, and finishing in glass core substrate production for AI advanced packaging.
Femto-pro Femtosecond Laser Machine for TGV Drilling in Glass Core Substrates
A compact femtosecond laser processing machine with proprietary GHz Pulse Injection Technology that forms TGV holes in glass directly via laser ablation without special optics or post-etching, achieving aspect ratios up to 240:1 in thin glass.
The complexity and cost of conventional TGV formation that requires laser modification + wet etching (multi-step, wet chemistry, environmental waste). Simpler direct laser drilling could reduce the process chain and eliminate chemical handling.
Contract CMP planarization of TSV and TGV filled-metal surfaces
Chemical-mechanical polish of copper-filled through-silicon or through-glass vias so the metal and substrate finish as a single plane for subsequent interconnect.
Filled TSV/TGV wafers and glass coupons leave Cu proud of the dielectric; without CMP the next wiring level cannot be patterned at package density.
Related Japanese companies
Companies shown here are linked from the published capability records in this hub.
TECNISCO, LTD.
Tokyo, Japan
Microfabrication specialist providing through-glass via (TGV) processing for glass wafers used in 3D wafer-level packaging and RF/MEMS applications.
NSC Co., Ltd.
Osaka, Japan
Chemical etching specialist offering large-format through-glass via (TGV) fabrication on glass substrates up to 730x920mm for 2.5D/3D semiconductor packaging.
Nanosystems JP Inc.
Tokyo, Japan
Precision microfabrication foundry specializing in Through-Glass Via (TGV) and advanced packaging processes for photonics and semiconductor interposers.
EBINAX株式会社 (EBINAX Co., Ltd.)
東京都大田区東糀谷5-22-13, Japan
End-to-end processing service provider for TGV (Through Glass Via) glass core substrates, covering glass procurement, micro-hole drilling via LPKF LIDE laser technology, seed layer formation, copper plating (conformal and filling), polishing, dicing, and inspection in a single workflow.
株式会社光響 (Symphotony / Kokyo, Inc.)
京都市下京区水銀屋町637, Japan
Femtosecond laser processing equipment manufacturer that developed 'Femto-pro' machine with proprietary GHz Pulse Injection Technology for direct laser drilling of TGV (Through Glass Via) in glass core substrates without special optics, achieving 5μm exit hole diameter with aspect ratio 240:1 in soda-lime glass.
Kitagawa Gress Tech Co., Ltd.
Hanamigawa-ku, Chiba, Japan
CMP, grind and dicing contract shop (Kitagawa group) that lists TSV and TGV metal-fill planarization among its semiconductor process services.
For teams qualifying this capability
- What glass format, via geometry, and application should the process support?
- Do you need a single TGV processing workflow or a specific unit operation?
- Which proof points and partnership stage should be reviewed first?